Invention Application
- Patent Title: Laser machining apparatus and method of adjusting the same
- Patent Title (中): 激光加工装置及其调整方法
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Application No.: US11597062Application Date: 2006-07-13
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Publication No.: US20090184096A1Publication Date: 2009-07-23
- Inventor: Hidehiko Karasaki , Tsutomu Sugiyama , Hitoshi Hongu
- Applicant: Hidehiko Karasaki , Tsutomu Sugiyama , Hitoshi Hongu
- Priority: JP2005-206440 20050715
- International Application: PCT/JP2006/313939 WO 20060713
- Main IPC: B23K26/38
- IPC: B23K26/38

Abstract:
A laser machining apparatus includes a laser generator for generating a laser beam and a driver unit for moving the laser beam relatively with respect to a workpiece as to emit the laser beam on the workpiece. The laser beam includes plural laser pulses. The laser pulses have spots each having a longitudinal direction. The driver unit moves the laser beam in the longitudinal direction relatively with respect to the workpiece so that the spots overlap each other. This laser machining apparatus can process the workpiece at high quality and high productivity.
Information query
IPC分类: