发明申请
US20090184390A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
半导体器件及其制造方法

  • 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
  • 专利标题(中): 半导体器件及其制造方法
  • 申请号: US12407843
    申请日: 2009-03-20
  • 公开(公告)号: US20090184390A1
    公开(公告)日: 2009-07-23
  • 发明人: Koki Ueno
  • 申请人: Koki Ueno
  • 优先权: JP2005-101445 20050331
  • 主分类号: H01L23/58
  • IPC分类号: H01L23/58
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要:
A semiconductor device is disclosed, which includes a semiconductor substrate including a device region and an isolation region having an isolation trench, a gate electrode formed on the device region through a gate insulating film, a first isolation insulating film formed in the isolation trench, the first isolation insulating film having a recess, a second isolation insulating film formed on the first isolation insulating film to be filled in the recess, the second isolation insulating film having an upper surface higher than the upper surface of the semiconductor substrate, and an impurity region formed in the semiconductor substrate under the first isolation insulating film, the impurity region having a conductivity type the same as a conductivity type of the semiconductor substrate, an impurity concentration higher than an impurity concentration of the semiconductor substrate, and a width of the impurity region smaller than a width of the isolation trench.
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