发明申请
- 专利标题： SURFACE ROUGHENING METHOD FOR LIGHT EMITTING DIODE SUBSTRATE
- 专利标题（中）： 用于发光二极管基板的表面粗糙化方法
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申请号： US12018086申请日： 2008-01-22
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公开(公告)号： US20090186435A1公开(公告)日： 2009-07-23
- 发明人: Nien-Tze Yeh , Chia-Ming Lee
- 申请人： Nien-Tze Yeh , Chia-Ming Lee
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
The present invention discloses a surface roughening method for an LED substrate, which uses a grinding technology and an abrasive paper of from No. 300 to No. 6000 to grind the surface of a substrate to form a plurality of irregular concave zones and convex zones on the surface of the substrate. Next, a semiconductor light emitting structure is formed on the surface of the substrate. The concave zones and convex zones can scatter and diffract the light inside LED, reduce the horizontally-propagating light between the substrate and the semiconductor layer, decrease the probability of total reflection and promote LED light extraction efficiency.
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