发明申请
US20090186962A1 Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good 有权
用于环氧树脂的微胶囊基固化剂,环氧树脂的母料基固化剂组合物,单组分环氧树脂组合物和加工良好

  • 专利标题: Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good
  • 专利标题(中): 用于环氧树脂的微胶囊基固化剂,环氧树脂的母料基固化剂组合物,单组分环氧树脂组合物和加工良好
  • 申请号: US12223523
    申请日: 2007-01-31
  • 公开(公告)号: US20090186962A1
    公开(公告)日: 2009-07-23
  • 发明人: Yoshikimi KondoHiroshi UchidaKazuhiro Daikai
  • 申请人: Yoshikimi KondoHiroshi UchidaKazuhiro Daikai
  • 优先权: JP20006-027073 20060203; JP2006-169786 20060620
  • 国际申请: PCT/JP2007/051595 WO 20070131
  • 主分类号: C08L63/00
  • IPC分类号: C08L63/00 C08J3/22
Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good
摘要:
Provided is a microcapsule-based hardener for an epoxy resin, which have a core (C) formed using a hardener (H) for the epoxy resin as a starting material and a shell (S) for covering the core (C) therewith. Since it is characterized in that the hardener (H) for the epoxy resin has an average particle size exceeding 0.3 μm and not greater than 12 μm; a content of a small-particle-size hardener for epoxy resin defined to have a particle size 0.5 time or less of the average particle size of the hardener (H) for the epoxy resin is from 0.1 to 15%; and the shell (S) has, on the surface thereof, a binding group (x) capable of absorbing infrared rays having a wave number of from 1630 to 1680 cm−1, a binding group (y) capable of absorbing infrared rays having a wave number of from 1680 to 1725 cm−1, and a binding group (z) capable of absorbing infrared rays having a wave number of from 1730 to 1755 cm−1, it is excellent in storage stability and at the same time, in reaction rapidity.
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