发明申请
- 专利标题: MEMS Capacitive Bending and Axial Strain Sensor
- 专利标题(中): MEMS电容弯曲和轴向应变传感器
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申请号: US12393294申请日: 2009-02-26
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公开(公告)号: US20090188325A1公开(公告)日: 2009-07-30
- 发明人: Julia W. Aebersold , Kevin Walsh , Mark Crain , Michael Voor
- 申请人: Julia W. Aebersold , Kevin Walsh , Mark Crain , Michael Voor
- 申请人地址: US KY Louisville
- 专利权人: OrthoData Technologies LLC
- 当前专利权人: OrthoData Technologies LLC
- 当前专利权人地址: US KY Louisville
- 主分类号: G01L1/14
- IPC分类号: G01L1/14
摘要:
A three-dimensional micro-electro-mechanical-systems (MEMS) capacitive bending and axial strain sensor capacitor is described. Two independent comb structures, incorporating suspended polysilicon interdigitated fingers, are fabricated simultaneously on a substrate that can displace independently of each other while attached to a substrate undergoing bending or axial deformation. A change in spacing between the interdigitated fingers will output a change in capacitance of the sensor and is the primary mode of operation of the device. On the bottom and to the end of each comb structure, a glass pad is attached to the comb structure to allow for ample surface area for affixing the sensor to a substrate. During fabrication, tethers are used to connect each comb structure to maintain equal spacing between the fingers before attachment to the substrate. After attachment, the tethers are broken to allow independent movement of each comb structure.
公开/授权文献
- US07854174B2 MEMS capacitive bending and axial strain sensor 公开/授权日:2010-12-21
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