发明申请
US20090189178A1 LEADFRAME HAVING A HEAT SINK SUPPORTING PART, FABRICATING METHOD OF A LIGHT EMITTING DIODE PACKAGE USING THE SAME, AND LIGHT EMITTING DIODE PACKAGE FABRICATED BY THE METHOD
有权
具有散热支撑部件的铅笔，使用其的发光二极管封装的制造方法和由该方法制成的发光二极管封装
- 专利标题： LEADFRAME HAVING A HEAT SINK SUPPORTING PART, FABRICATING METHOD OF A LIGHT EMITTING DIODE PACKAGE USING THE SAME, AND LIGHT EMITTING DIODE PACKAGE FABRICATED BY THE METHOD
- 专利标题（中）： 具有散热支撑部件的铅笔，使用其的发光二极管封装的制造方法和由该方法制成的发光二极管封装
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申请号： US12304663申请日： 2007-06-28
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公开(公告)号： US20090189178A1公开(公告)日： 2009-07-30
- 发明人: Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
- 申请人： Do Hyung Kim , Suk Jin Kang , Hyuck Jung Choi , Jung Hoo Seo
- 优先权： KR10-2006-0060823 20060630; KR10-2007-0063395 20070627
- 国际申请： PCT/KR07/03148 WO 20070628
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L23/495 ; H01L21/50 ; H01L23/36
摘要：
Disclosed are a leadframe having heat sink supporting parts, a light emitting diode package in which the leadframe is employed, and a fabricating method of a light emitting diode package using the leadframe. The leadframe includes an outer frame surrounding a predetermined region. The heat sink supporting parts extend inward to face each other from the outer frame. Each of the supporting parts has an end portion coupled to a heat sink. Further, lead terminals extend inward to face each other from the outer frame. The lead terminals are spaced apart from the supporting parts. Accordingly, a package main body can be formed by an insert molding technique after the heat sink is coupled to the end portions of the supporting parts, and the heat sink and the lead terminals can be easily aligned.
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