A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package. The semiconductor package includes a substrate having a first surface and a second surface, a semiconductor chip mounted on the first surface of the substrate, at least one land disposed on the second surface of the substrate, and whose circumference includes a plurality of first group arcs, a mask layer covering the second surface of the substrate and including at least one opening that exposes the at least one land, and at least one external terminal disposed on the at least one land, wherein a portion of the at least one land is covered by the mask layer, and a sidewall of another portion of the at least one land is exposed by the at least one opening, and the circumference of the at least one opening includes a plurality of second group arcs, and a radius of the outermost arc from among the plurality of first group arcs is equal to a radius of the outermost arc from among the plurality of second group arcs.