发明申请
- 专利标题: Resin infusion potting
- 专利标题(中): 树脂灌注灌封
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申请号: US12378505申请日: 2009-02-17
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公开(公告)号: US20090189308A1公开(公告)日: 2009-07-30
- 发明人: Kevin J. Barefield , Richard V. Campbell
- 申请人: Kevin J. Barefield , Richard V. Campbell
- 主分类号: B29C65/00
- IPC分类号: B29C65/00
摘要:
A process for forcibly infusing liquid potting compound into the exposed strands of a cable prior to forming a termination. The process uses a mold that encloses the exposed strands. Potting compound is then pumped into the mold, where it runs around and through the exposed strands. A second venting passage is preferably employed, so that the liquid potting compound flows through the mold without trapping any air pockets.
公开/授权文献
- US08048357B2 Resin infusion potting 公开/授权日:2011-11-01
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