发明申请
- 专利标题: METHOD OF BONDING, THINNING, AND RELEASING WAFER
- 专利标题(中): 粘结,稀释和释放的方法
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申请号: US12309706申请日: 2007-05-21
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公开(公告)号: US20090199957A1公开(公告)日: 2009-08-13
- 发明人: Yoshihiro Inao
- 申请人: Yoshihiro Inao
- 申请人地址: JP Kanagawa
- 专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人: Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址: JP Kanagawa
- 优先权: JP2006-206319 20060728
- 国际申请: PCT/JP2007/000540 WO 20070521
- 主分类号: B32B38/00
- IPC分类号: B32B38/00 ; B32B37/14 ; B32B38/10
摘要:
An adhesive agent layer for bonding a support plate (1) and a wafer (5) is in a three-layer configuration in which a hard layer (31) is sandwiched between soft layers (32) and (33) from above and below. Both the top and bottom surfaces of the adhesive agent layer are soft adhesive agent layers, which results in an excellent bonding affinity with the wafer 5 and the support plate (1). Accordingly, the peripheral portion of the wafer (5) can be prevented from being lifted before a dicing process. Further, because the sandwiched adhesive agent layer is the hard adhesive agent layer (31), even when the non-adhesive surface of the support plate (1) is vacuum suctioned, or when a pressure is applied from a grinder, the hard adhesive agent layer (31) is not deformed according to the soft adhesive agent layer (33) being drawn or pushed into through holes (2).
公开/授权文献
- US08080121B2 Method of bonding, thinning, and releasing wafer 公开/授权日:2011-12-20