发明申请
- 专利标题: SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体器件
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申请号: US12430439申请日: 2009-04-27
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公开(公告)号: US20090200677A1公开(公告)日: 2009-08-13
- 发明人: Koji TAKEMURA , Hiroshige Hirano , Yutaka Itoh , Hikari Sano , Masao Takahashi , Koji Koike
- 申请人: Koji TAKEMURA , Hiroshige Hirano , Yutaka Itoh , Hikari Sano , Masao Takahashi , Koji Koike
- 申请人地址: JP Osaka
- 专利权人: PANASONIC CORPORATION
- 当前专利权人: PANASONIC CORPORATION
- 当前专利权人地址: JP Osaka
- 优先权: JP2005-176824 20050616
- 主分类号: H01L23/522
- IPC分类号: H01L23/522
摘要:
A semiconductor device includes at least three or more wiring layers stacked in an interlayer insulating film on a semiconductor substrate, a seal ring provided at the outer periphery of a chip region of the semiconductor substrate and a chip strength reinforcement provided in part of the chip region near the seal ring. The chip strength reinforcement is made of a plurality of dummy wiring structures and each of the plurality of dummy wiring structures is formed to extend across and within two or more of the wiring layers including one or none of the bottommost wiring layer and the topmost wiring layer using a via portion.
公开/授权文献
- US07888801B2 Semiconductor device 公开/授权日:2011-02-15