发明申请
- 专利标题： PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
- 专利标题（中）： 印刷线路板及其制造方法
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申请号： US12420469申请日： 2009-04-08
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公开(公告)号： US20090205857A1公开(公告)日： 2009-08-20
- 发明人: Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- 申请人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
- 申请人地址： JP Ogaki-shi
- 专利权人： IBIDEN CO., LTD
- 当前专利权人： IBIDEN CO., LTD
- 当前专利权人地址： JP Ogaki-shi
- 优先权： JP10-272799 19980928; JP10-276010 19980929; JP10-276011 19980929; JP10-290450 19981013; JP10-310445 19981030; JP10-351572 19981210; JP10-354733 19981214; JP10-372274 19981228; JP11-106184 19990414; JP11-187418 19990701
- 主分类号： H05K1/03
- IPC分类号： H05K1/03
摘要：
A multilayer printed circuit board including a substrate board having a lower conductor circuit, a resin insulating layer formed over the substrate board and lower conductor circuit, and a conductor circuit formed over the resin insulating layer. The resin insulating layer has a via hole filled up with plating and is formed of a linear polyolefin resin formed by hot-pressing a film shaped resin.
公开/授权文献
- US08093507B2 Printed wiring board and method for producing the same 公开/授权日：2012-01-10
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