发明申请
US20090211086A1 ELECTRONIC COMPONENT MOUNTING METHOD AND ELETRONIC COMPONENT AND MOUNTING APPARATUS 有权
电子元件安装方法和ELETRONIC组件和安装设备

ELECTRONIC COMPONENT MOUNTING METHOD AND ELETRONIC COMPONENT AND MOUNTING APPARATUS
摘要:
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
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