发明申请
US20090211086A1 ELECTRONIC COMPONENT MOUNTING METHOD AND ELETRONIC COMPONENT AND MOUNTING APPARATUS
有权
电子元件安装方法和ELETRONIC组件和安装设备
- 专利标题: ELECTRONIC COMPONENT MOUNTING METHOD AND ELETRONIC COMPONENT AND MOUNTING APPARATUS
- 专利标题(中): 电子元件安装方法和ELETRONIC组件和安装设备
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申请号: US12434500申请日: 2009-05-01
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公开(公告)号: US20090211086A1公开(公告)日: 2009-08-27
- 发明人: Akira AOKI , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
- 申请人: Akira AOKI , Makio Kameda , Yoshiharu Fukushima , Katsuyuki Seto , Hideaki Fukushima
- 申请人地址: JP Gunma
- 专利权人: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
- 当前专利权人: HITACHI HIGH-TECH INSTRUMENTS CO., LTD.
- 当前专利权人地址: JP Gunma
- 优先权: JP2005-021957 20050128
- 主分类号: H05K3/30
- IPC分类号: H05K3/30
摘要:
The invention is directed to prevention of interference of an operation of mounting proper electronic components and improvement of usability without reduction of a manufacturing speed of printed boards. Suction states of electronic components held by suction by suction nozzles are detected by a line sensor unit. When the detection result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal a component recognition camera takes images of electronic components judged proper as a result of the detection and a recognition processing device performs a recognition process. When the recognition result shows that there is an improper electronic component, the improper electronic component is disposed of, and after the disposal only electronic components judged proper as a result of the recognition are mounted on a printed board.
公开/授权文献
- US08186047B2 Method of mounting electronic component 公开/授权日:2012-05-29
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