发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES
- 专利标题（中）： 用于堆叠设备的集成电路封装系统
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申请号： US12037291申请日： 2008-02-26
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公开(公告)号： US20090212408A1公开(公告)日： 2009-08-27
- 发明人: DaeSik Choi , Sang-Ho Lee , Soo-San Park
- 申请人： DaeSik Choi , Sang-Ho Lee , Soo-San Park
- 主分类号： H01L23/49
- IPC分类号： H01L23/49
摘要：
An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.
公开/授权文献
- US08067307B2 Integrated circuit package system for stackable devices 公开/授权日：2011-11-29
信息查询
IPC分类:
