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发明申请
US20090213562A1 System for interconnecting two substrates each comprising at least one transmission line 有权
用于互连两个基板的系统，每个基板包括至少一个传输线

System for interconnecting two substrates each comprising at least one transmission line
摘要：
The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole.The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.
摘要（中）：

本发明涉及第一衬底（1）的互连系统，其包括至少一个第一传输线（3），第一传输线（3）和第二衬底（10）包括至少一个第二传输线（11），第一衬底的取向与 相对于第二基板是任意的。 第一衬底（1）包括在所述第一线的一个末端处的至少一个金属化孔，并且第二衬底（10）包括延伸所述第二线的突出元件和节省地面的所述突出元件，所述突出元件插入到金属化孔中。 本发明特别适用于微波领域，并且可以将包括印刷天线的基板与接收信号的处理电路的基板互连。

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