发明申请
US20090224390A1 INTEGRATED CIRCUIT WITH STEP MOLDED INNER STACKING MODULE PACKAGE IN PACKAGE SYSTEM
有权
集成电路与封装系统中的步进模块封装模块封装
- 专利标题： INTEGRATED CIRCUIT WITH STEP MOLDED INNER STACKING MODULE PACKAGE IN PACKAGE SYSTEM
- 专利标题（中）： 集成电路与封装系统中的步进模块封装模块封装
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申请号： US12045646申请日： 2008-03-10
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公开(公告)号： US20090224390A1公开(公告)日： 2009-09-10
- 发明人: DeokKyung Yang , In Sang Yoon , Jae Han Chung
- 申请人： DeokKyung Yang , In Sang Yoon , Jae Han Chung
- 主分类号： H01L23/49
- IPC分类号： H01L23/49 ; H01L21/56
摘要：
An integrated circuit package system including: providing a substrate; mounting an integrated circuit above the substrate; mounting an inner stacking module, having an inner stacking module encapsulation and a molded integral step molded in the inner stacking module encapsulation, above the integrated circuit; and encapsulating the inner stacking module, and the integrated circuit with an encapsulation.
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