发明申请
- 专利标题: Improved Heat-Dissipation Structure
- 专利标题(中): 改进的散热结构
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申请号: US12042634申请日: 2008-03-05
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公开(公告)号: US20090225554A1公开(公告)日: 2009-09-10
- 发明人: Kun-Jung Chang , Ching-Yuan Juan , Kuo-Chun Lin , Ching-Huang Juan
- 申请人: Kun-Jung Chang , Ching-Yuan Juan , Kuo-Chun Lin , Ching-Huang Juan
- 申请人地址: TW Kaohsiung County
- 专利权人: Li-Hong Technological, Co., Ltd.
- 当前专利权人: Li-Hong Technological, Co., Ltd.
- 当前专利权人地址: TW Kaohsiung County
- 主分类号: F21V29/00
- IPC分类号: F21V29/00
摘要:
An improved heat-dissipation structure includes a heat-dissipation lamp frame which comprises: a heat-dissipation structure and a plurality of heat-dissipation lamp sets. The heat-dissipation structure has a plurality of heat-dissipation fins on one side thereof, and the heat-dissipation lamp sets are accommodated on the other side of the heat-dissipation structure. An inlay slot is formed along the perimeter of the heat-dissipation lamp sets and is used to accommodate a light guiding tube which is a hollow and tube-like structure and has an inlay rim. The light guiding tube passes through the opening and is inlaid in the inlay slot of the heat-dissipation lamp frame. A casing is a metallic shell and has a through-hole on one side thereof to accept the heat-dissipation lamp frame. The casing has an opening on the other side thereof. A light-permeable cover is a light-permeable hood and has a contact plane on one side thereof.
公开/授权文献
- US07771090B2 Heat-dissipation structure 公开/授权日:2010-08-10
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