发明申请
- 专利标题: METHOD FOR CONCURRENT THERMAL SPRAY AND COOLING HOLE CLEANING
- 专利标题(中): 用于同时热喷涂和冷却孔清洁的方法
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申请号: US11460664申请日: 2006-07-28
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公开(公告)号: US20090226626A1公开(公告)日: 2009-09-10
- 发明人: Bhupendra K. GUPTA , Mark M. Glevicky , George E. Moertle , Ray HEIDORN , Tom TOMLINSON , Thomas George Holland
- 申请人: Bhupendra K. GUPTA , Mark M. Glevicky , George E. Moertle , Ray HEIDORN , Tom TOMLINSON , Thomas George Holland
- 申请人地址: US NY Schenectady
- 专利权人: GENERAL ELECTRIC COMPANY
- 当前专利权人: GENERAL ELECTRIC COMPANY
- 当前专利权人地址: US NY Schenectady
- 主分类号: C23C4/12
- IPC分类号: C23C4/12
摘要:
A method for applying a thermal barrier coating to an article having cooling holes and concurrently cleaning obstructions, such as TBC overspray or other debris, from those holes is disclosed. A thermal barrier coating is applied to a first surface of an article having cooling holes. Concurrently therewith, a plurality of particles are projected against a second surface of the article, such that at least some of the particles pass through the cooling holes, strike the overspray constituents prior to cooling, knocking at least some of the obstructions out of the cooling hole.
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