A plating apparatus includes a plating tank for storing a plating liquid, and applies a magnetic alloy plating to a shaft-shaped member immersed in the plating liquid by using the shaft-shaped member as a cathode. The plating apparatus further includes a routable member configured to rotate the shaft-shaped member as a rotary shaft; annular shielding tools mounted on the outer peripheral surface of the shaft-shaped member; a plating liquid discharge nozzle including plating liquid discharge ports which are provided to face the shaft-shaped member so as to avoid the shielding tools; and an anode provided around the shaft-shaped member and the plating liquid discharge nozzle.