发明申请
- 专利标题: INTERFACE MODULE
- 专利标题(中): 接口模块
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申请号: US12048859申请日: 2008-03-14
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公开(公告)号: US20090233469A1公开(公告)日: 2009-09-17
- 发明人: Shawn Phillip Tobey , Paul John Pepe , Sheldon Easton Muir
- 申请人: Shawn Phillip Tobey , Paul John Pepe , Sheldon Easton Muir
- 申请人地址: US PA Berwyn
- 专利权人: TYCO ELECTRONICS CORPORATION
- 当前专利权人: TYCO ELECTRONICS CORPORATION
- 当前专利权人地址: US PA Berwyn
- 主分类号: H01R13/648
- IPC分类号: H01R13/648
摘要:
An interface module includes a housing configured to hold at least one modular jack. The housing is configured to be mounted on a panel. The housing includes an electrically conductive portion. An electrically conductive fastener has a housing interface configured to engage the electrically conductive portion of the housing and a panel interface configured to engage an electrically conductive surface of the panel. The electrically conductive fastener creates an electrical connection between the housing and the panel.
公开/授权文献
- US07828592B2 Interface module 公开/授权日:2010-11-09
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