发明申请
US20090233546A1 TRANSMISSION METHOD, INTERFACE CIRCUIT, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE AND MEMORY MODULE 失效
传输方法,接口电路,半导体器件,半导体封装,半导体模块和存储器模块

  • 专利标题: TRANSMISSION METHOD, INTERFACE CIRCUIT, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE AND MEMORY MODULE
  • 专利标题(中): 传输方法,接口电路,半导体器件,半导体封装,半导体模块和存储器模块
  • 申请号: US12065068
    申请日: 2006-08-04
  • 公开(公告)号: US20090233546A1
    公开(公告)日: 2009-09-17
  • 发明人: Hideki SasakiMuneo FukaishiToru Taura
  • 申请人: Hideki SasakiMuneo FukaishiToru Taura
  • 申请人地址: JP Minato-ku
  • 专利权人: NEC CORPORATION
  • 当前专利权人: NEC CORPORATION
  • 当前专利权人地址: JP Minato-ku
  • 优先权: JP2005-255576 20050902
  • 国际申请: PCT/JP2006/315509 WO 20060804
  • 主分类号: H04B5/00
  • IPC分类号: H04B5/00
TRANSMISSION METHOD, INTERFACE CIRCUIT, SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE AND MEMORY MODULE
摘要:
An interface circuit, which uses electromagnetic induction to perform a signal transmission, comprises a transmission coil and a transmission circuit that provides a signal to the transmission coil, thereby causing the transmission coil to output a triangular or roughly triangular magnetic field signal.
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