发明申请
US20090236230A1 Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
有权
用于用金属填充通孔的电镀工艺，特别是具有铜的印刷电路板
- 专利标题： Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
- 专利标题（中）： 用于用金属填充通孔的电镀工艺，特别是具有铜的印刷电路板
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申请号： US11661704申请日： 2005-08-30
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公开(公告)号： US20090236230A1公开(公告)日： 2009-09-24
- 发明人: Bert Reents , Thomas Pliet , Bernd Roelfs , Toshiya Fujiwara , Rene Wenzel , Markus Youkhanis , Soungsoo Kim
- 申请人： Bert Reents , Thomas Pliet , Bernd Roelfs , Toshiya Fujiwara , Rene Wenzel , Markus Youkhanis , Soungsoo Kim
- 优先权： DE102004045451.5 20040920
- 国际申请： PCT/EP05/09332 WO 20050830
- 主分类号： C25D5/18
- IPC分类号： C25D5/18
摘要：
The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating