发明申请
- 专利标题: BOARD UNIT AND ELECTRONIC APPARATUS
- 专利标题(中): 板单元和电子设备
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申请号: US12369213申请日: 2009-02-11
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公开(公告)号: US20090237883A1公开(公告)日: 2009-09-24
- 发明人: Jie WEI , Keizou TAKEMURA
- 申请人: Jie WEI , Keizou TAKEMURA
- 申请人地址: JP Kawasaki-shi
- 专利权人: FUJITSU LIMITED
- 当前专利权人: FUJITSU LIMITED
- 当前专利权人地址: JP Kawasaki-shi
- 优先权: JP2008-75622 20080324
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is received by the heat generating component, a heat insulating material that is superimposed on an outer surface of the first heat transfer plate and that insulates heat dissipation, a second heat transfer plate that continues to the first heat transfer plate and that defines a heat conducting surface and a heat receiver that is received by the heat conducting surface of the second heat transfer plate and that defines a flow path of a coolant.
公开/授权文献
- US07933125B2 Board unit and electronic apparatus 公开/授权日:2011-04-26
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