发明申请
US20090238232A1 Method of Protecting Semiconductor Chips from Mechanical and ESD Damage During Handling
有权
保护半导体芯片在处理过程中免受机械和ESD损害的方法
- 专利标题： Method of Protecting Semiconductor Chips from Mechanical and ESD Damage During Handling
- 专利标题（中）： 保护半导体芯片在处理过程中免受机械和ESD损害的方法
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申请号： US12476895申请日： 2009-06-02
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公开(公告)号： US20090238232A1公开(公告)日： 2009-09-24
- 发明人: Richard Carson , Elaine Taylor , Douglas Collins
- 申请人： Richard Carson , Elaine Taylor , Douglas Collins
- 申请人地址： US NM Albuquerque
- 专利权人： EMCORE Corporation
- 当前专利权人： EMCORE Corporation
- 当前专利权人地址： US NM Albuquerque
- 主分类号： H01S5/00
- IPC分类号： H01S5/00 ; H01L33/00 ; H01L31/02 ; H01L21/78 ; H02H9/00
摘要：
A method and apparatus are provided for protecting a semiconductor device from damage. The method may include the steps of providing an active semiconductor device on a surface of a semiconductor substrate where the active device is surrounded by an inactive semiconductor area, and providing a soft metallic guard element in the inactive semiconductor area around at least a portion of the periphery of the active device wherein the metallic guard element is connected to ground potential and not to the active device.
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