发明申请
- 专利标题: MOUNTING APPARATUS FOR ELECTRONIC COMPONENTS
- 专利标题(中): 电子元件安装设备
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申请号: US12409554申请日: 2009-03-24
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公开(公告)号: US20090241327A1公开(公告)日: 2009-10-01
- 发明人: Hisayoshi KASHITANI , Kazuyoshi Ieizumi
- 申请人: Hisayoshi KASHITANI , Kazuyoshi Ieizumi
- 专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 当前专利权人: Hitachi High-Tech Instruments Co., Ltd.
- 优先权: JP2008-078077 20080325
- 主分类号: B23P19/00
- IPC分类号: B23P19/00
摘要:
In a mounting apparatus for electronic components, a command from a host computer is transmitted to a linear motor M via a motion controller and a servo amplifier to thereby drive a mounting head H1 or a mounting head H2. To prevent collision between the two mounting heads H1, H2, position information from a linear encoder E is fed back to not only the servo amplifier, but also the motion controller. Once determining that the two mounting heads H1, H2 collide, the motion controller applies brake to the mounting heads H1, H2 to avoid collision therebetween, regardless of the command from the host computer.
公开/授权文献
- US08079138B2 Mounting apparatus for electronic components 公开/授权日:2011-12-20
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