Invention Application
- Patent Title: TIRE PUNCTURE REPAIR DEVICE
- Patent Title (中): 轮胎修理装置
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Application No.: US12406622Application Date: 2009-03-18
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Publication No.: US20090241738A1Publication Date: 2009-10-01
- Inventor: Mitsuru Naito
- Applicant: Mitsuru Naito
- Applicant Address: JP Tokyo
- Assignee: THE YOKOHAMA RUBBER CO., LTD.
- Current Assignee: THE YOKOHAMA RUBBER CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2008-077118 20080325
- Main IPC: B29C73/02
- IPC: B29C73/02

Abstract:
Provided is a tire puncture repair device capable of injecting a puncture sealing agent into a tire stably and speedily. A container is compressed between plate members by placing one of the plate members on the ground and pressing down the other one of the plate members with a foot. Thereby, the puncture sealing agent is discharged from the container and is injected into the tire through an injection tube. Discharge amount control means is attached to the injection tube to level an amount of the puncture sealing agent to be discharged.
Public/Granted literature
- US08028606B2 Tire puncture repair device Public/Granted day:2011-10-04
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