发明申请
- 专利标题: PRINTED CIRCUIT BOARD
- 专利标题(中): 印刷电路板
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申请号: US12126748申请日: 2008-05-23
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公开(公告)号: US20090242244A1公开(公告)日: 2009-10-01
- 发明人: SHOU-KUO HSU , CHUN-JEN CHEN
- 申请人: SHOU-KUO HSU , CHUN-JEN CHEN
- 申请人地址: TW Tu-Cheng
- 专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人: HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: TW Tu-Cheng
- 优先权: CN200810300775.5 20080328
- 主分类号: H05K1/00
- IPC分类号: H05K1/00
摘要:
An exemplary PCB includes a first reference layer, a first signal layer, and a second signal layer in that order. A first differential pair is arranged in the first signal layer in an edge-coupled structure referencing the first reference layer. A second differential pair is arranged in the second signal layer in edge-coupled structure. A first ground part and a second ground part are symmetrically arranged at opposite sides of the second differential pair in the second signal layer. The first differential pair is arranged above the first ground part and a projection of the first differential pair onto the second signal layer having an area coincident with the first ground part. The second differential pair references the first and second ground parts.
公开/授权文献
- US08013255B2 Printed circuit board with high density differential pairs 公开/授权日:2011-09-06
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