发明申请
- 专利标题: STRUCTURE FOR REDUCTION OF SOFT ERROR RATES IN INTEGRATED CIRCUITS
- 专利标题(中): 用于降低集成电路中软错误率的结构
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申请号: US12483364申请日: 2009-06-12
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公开(公告)号: US20090243053A1公开(公告)日: 2009-10-01
- 发明人: Cyril Cabral, JR. , Michael S. Gordon , Kenneth P. Rodbell
- 申请人: Cyril Cabral, JR. , Michael S. Gordon , Kenneth P. Rodbell
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L23/556
- IPC分类号: H01L23/556
摘要:
A structure for reduction of soft error rates in integrated circuits. The structure including: a semiconductor substrate; and a stack of one or more wiring levels stacked from a lowermost wiring level to an uppermost wiring level, the lowermost wiring level nearer the semiconductor substrate than the uppermost wiring level; and an alpha particle blocking layer on a top surface of the uppermost wiring level of the one or more wiring levels, the blocking layer comprising metal wires and a dielectric material, the blocking layer having a combination of a thickness of the blocking layer and a volume percent of metal wires in the blocking layer sufficient to stop a predetermined percentage of alpha particles of a selected energy or less striking the blocking layer from penetrating into the stack of one or more wiring levels or the substrate.
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