发明申请
- 专利标题： APPARATUS AND METHOD FOR ATTACHING A HEAT DISSIPATING DEVICE
- 专利标题（中）： 用于连接热消散装置的装置和方法
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申请号： US12059931申请日： 2008-03-31
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公开(公告)号： US20090243085A1公开(公告)日： 2009-10-01
- 发明人: Sabina J. Houle
- 申请人： Sabina J. Houle
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L21/60
摘要：
A microelectronic package is provided. The microelectronic package includes a heat dissipating device having a top side and a bottom side and a thermal interface material disposed adjacent to the bottom side of the heat dissipating device. The microelectronic package also includes a patterned metal layer comprising at least two metals disposed on the bottom side of the heat dissipating device, wherein the patterned metal layer is to adhere the heat dissipating device to the thermal interface material.
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