发明申请
- 专利标题: WINDOW TYPE BGA SEMICONDUCTOR PACKAGE AND ITS SUBSTRATE
- 专利标题(中): WINDOW型BGA半导体封装及其基板
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申请号: US12056797申请日: 2008-03-27
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公开(公告)号: US20090243099A1公开(公告)日: 2009-10-01
- 发明人: Wen-Jeng FAN , Yi-Ling Liu , Shin-Hui Huang , Tsai-Chuan Yu
- 申请人: Wen-Jeng FAN , Yi-Ling Liu , Shin-Hui Huang , Tsai-Chuan Yu
- 专利权人: POWERTECH TECHNOLOGY INC.
- 当前专利权人: POWERTECH TECHNOLOGY INC.
- 主分类号: H01L23/49
- IPC分类号: H01L23/49
摘要:
A window-type BGA semiconductor package is revealed, primarily comprising a substrate with a wire-bonding slot, a chip disposed on a top surface of the substrate, and a plurality of bonding wires passing through the wire-bonding slot. A plurality of plating line stubs are formed on a bottom surface of the substrate, connect the bonding fingers on the substrate and extend to the wire-bonding slot. The bonding wires electrically connect the bonding pads of the chip to the corresponding bonding fingers of the substrate. The plating line stubs are compliant to the wire-bonding paths of the bonding wires correspondingly connected at the bonding fingers, such as parallel to the overlapped arrangement, to avoid electrical short between the plating line stubs and the bonding wires with no corresponding relationship of electrical connections.
公开/授权文献
- US07732921B2 Window type BGA semiconductor package and its substrate 公开/授权日:2010-06-08