发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT
- 专利标题(中): 半导体器件和半导体集成电路
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申请号: US12370338申请日: 2009-02-12
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公开(公告)号: US20090245445A1公开(公告)日: 2009-10-01
- 发明人: Makoto Saen , Kenichi Osada , Shigenobu Komatsu , Itaru Nonomura , Yasuhisa Shimazaki
- 申请人: Makoto Saen , Kenichi Osada , Shigenobu Komatsu , Itaru Nonomura , Yasuhisa Shimazaki
- 专利权人: RENESAS TECHNOLOGY CORP.
- 当前专利权人: RENESAS TECHNOLOGY CORP.
- 优先权: JP2008-082483 20080327
- 主分类号: H04L7/00
- IPC分类号: H04L7/00
摘要:
A semiconductor device including a pair of stacked semiconductor ICs capable of communicating with each other by wireless. Each IC has: a transmitter circuit operable to send, by wireless, transmit data together with a clock signal deciding a transmission timing, and arranged so that the wireless transmission timing is adjustable; a receiver circuit operable to receive data in synchronization with a clock signal received by wireless, and arranged so that its wireless reception timing is adjustable; and a control circuit operable to perform timing adjustments of the transmitter and receiver circuits based on a result of authentication of data returned by the other IC in response to data transmitted through the transmitter circuit, and received by the receiver circuit. This arrangement for near field communication between stacked semiconductor ICs enables: reduction of the scale of a circuit for communication timing adjustment; and highly accurate adjustment of the communication timing.
公开/授权文献
- US08054871B2 Semiconductor device and semiconductor integrated circuit 公开/授权日:2011-11-08
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