Invention Application
- Patent Title: RESIN COMPOSITION AND MOLDED PRODUCT THEREOF
- Patent Title (中): 树脂组合物及其成型产品
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Application No.: US12294287Application Date: 2007-03-22
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Publication No.: US20090253844A1Publication Date: 2009-10-08
- Inventor: Yoshikuni Akiyama , Minoru Sakata , Yukihiro Ban
- Applicant: Yoshikuni Akiyama , Minoru Sakata , Yukihiro Ban
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI CHEMICALS CORPORATION
- Current Assignee: ASAHI KASEI CHEMICALS CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2006-095403 20060330; JP2006-291444 20061026
- International Application: PCT/JP2007/055804 WO 20070322
- Main IPC: C08K3/22
- IPC: C08K3/22 ; C08K3/04 ; C08K3/30 ; C08K3/26 ; C08K3/36 ; C08K3/40

Abstract:
An object of the present invention is to provide a resin composition in which a surface resistivity and a volume resistivity actually measured in an antistatic region and an electrostatic diffusion region are equivalent to each other, and a remolded product produced by reutilizing a molded product which can hold the above properties. Specifically, disclosed is a resin composition comprising: 100 parts by weight of (a) a thermoplastic resin; 20 to 80 parts by weight of (b) a nonconductive fibrous inorganic filler having an average fiber diameter of not more than 15 μm; and 10 to 70 parts by weight of the total of (c1) a graphite and (c2) a graphite in which (c) graphite having an average particle diameter of 1 μm to 50 μm wherein each kind thereof has a different particle diameter; and at least one of differences in average particle diameter between two kinds thereof is not less than 5 μm.
Public/Granted literature
- US08487035B2 Resin composition and molded product thereof Public/Granted day:2013-07-16
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