发明申请
- 专利标题： HEAT-RESISTANT RESIN PASTE
- 专利标题（中）： 耐热树脂胶
-
申请号： US12375719申请日： 2007-06-01
-
公开(公告)号： US20090264582A1公开(公告)日： 2009-10-22
- 发明人: Hiroyuki Kawakami , Kouji Yamazaki , Takuya Imai , Youji Katayama
- 申请人： Hiroyuki Kawakami , Kouji Yamazaki , Takuya Imai , Youji Katayama
- 优先权： JP2006-207931 20060731
- 国际申请： PCT/JP2007/061192 WO 20070601
- 主分类号： C08L79/08
- IPC分类号： C08L79/08 ; C08L101/00
摘要：
Provided is a heat-resistant resin paste excellent in heat resistance, flexibility, printability and viewability. A heat-resistant resin paste containing a first organic solvent (A1), a second organic solvent (A2) containing a lactone, a heat-resistant resin (B) soluble in a mixed solvent of the solvents (A1) and (A2), a heat-resistant resin filler (C) insoluble in the mixed organic solvent of the solvents (A1) and (A2), and a pigment (D), wherein the components (C) and (D) are dispersed in a solution containing the solvents (A1) and (A2) and the component (B).
公开/授权文献
- US08759440B2 Heat-resistant resin paste 公开/授权日：2014-06-24
信息查询
