发明申请
US20090273061A1 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR SUBSTRATE 有权
半导体衬底,半导体器件和制造半导体衬底的方法

  • 专利标题: SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR SUBSTRATE
  • 专利标题(中): 半导体衬底,半导体器件和制造半导体衬底的方法
  • 申请号: US12094564
    申请日: 2006-11-17
  • 公开(公告)号: US20090273061A1
    公开(公告)日: 2009-11-05
  • 发明人: Koichiro Kishima
  • 申请人: Koichiro Kishima
  • 申请人地址: JP Tokyo
  • 专利权人: SONY CORPORATION
  • 当前专利权人: SONY CORPORATION
  • 当前专利权人地址: JP Tokyo
  • 优先权: JP2005-339466 20051124
  • 国际申请: PCT/JP2006/323023 WO 20061117
  • 主分类号: H01L29/02
  • IPC分类号: H01L29/02 H01L21/78
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR SUBSTRATE
摘要:
A double-structure silicon on insulator (SOI) substrate with a silicon layer, an insulation film (silicon oxide film), a silicon layer, and an insulation film in this order from the side of the surface. The upper-layer insulation film is formed so as to have a uniform distribution of depth while the lower-layer insulation film is formed so as to have a non-uniform distribution of depth so that a thick portion may be formed in the silicon layer along a predetermined path. The refractive index of Si is 3.5 and the refractive index of SiO2 is 1.5. The thick portion of the silicon layer provides a core and the insulation films corresponding to this thick portion provide clads, thereby forming an optical waveguide along the predetermined path. The silicon layer at the side of the surface has a uniform thickness, thereby enabling characteristics of MOS devices fabricated on various portions of the silicon layer to be met with each other easily and facilitating a design of the electrical device as a whole.
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