Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE HAVING PASSIVE COMPONENT BUMPS
- Patent Title (中): 具有被动元件爆破的半导体封装
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Application No.: US12245453Application Date: 2008-10-03
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Publication No.: US20090273079A1Publication Date: 2009-11-05
- Inventor: J. Thomas Lovskog
- Applicant: J. Thomas Lovskog
- Applicant Address: SE Lund
- Assignee: SONY ERICSSON MOBILE COMMUNICATIONS AB
- Current Assignee: SONY ERICSSON MOBILE COMMUNICATIONS AB
- Current Assignee Address: SE Lund
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H05K1/00
Abstract:
A semiconductor package includes contact bumps configured as passive circuit components. One or more contact bumps of the semiconductor package may be formed or configured as pull-up resistors, pull-down resistors, capacitors or inductors.
Information query
IPC分类:
