A method for testing adhesive bond quality includes subjecting an adhesively-bonded workpiece to a known loading function. The loading function may be cyclic, linear, or nonlinear, and configured not to damage the workpiece. Response characteristics of the workpiece are measured during the loading. Measured response characteristics are compared with baseline or nominal characteristics and the adhesive bond quality is determined from the resulting comparison. A differential signal may be generated based upon the comparison of measured response and baseline characteristics and used to determine the adhesive bond quality, possibly with an algorithm. Being within the acceptable range is indicative of acceptable adhesive bond quality. The root cause of failure may be determined and a course of action based thereupon; including: localized curing, inspection, repair, and destruction. Following corrective courses of action, the workpiece may be re-tested and compared again to the baseline.