Invention Application
- Patent Title: INVERTER MODULE WITH THERMALLY SEPARATED SEMICONDUCTOR DEVICES
- Patent Title (中): 具有热分离半导体器件的逆变器模块
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Application No.: US12123300Application Date: 2008-05-19
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Publication No.: US20090285004A1Publication Date: 2009-11-19
- Inventor: Brian A. WELCHKO
- Applicant: Brian A. WELCHKO
- Applicant Address: US MI Detroit
- Assignee: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
- Current Assignee: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
- Current Assignee Address: US MI Detroit
- Main IPC: H02M7/537
- IPC: H02M7/537 ; H02M1/00

Abstract:
Systems and apparatus are provided for an inverter module for use in a vehicle. The inverter module comprises a first electrical base and a second electrical base each having an electrically conductive mounting surface, wherein the electrical bases are physically distinct and electrically coupled. A first semiconductor switch has a surface terminal that is coupled to the electrically conductive mounting surface of the first electrical base. A second semiconductor switch has a surface terminal that is coupled to the electrically conductive mounting surface of the first electrical base. A first semiconductor diode and a second semiconductor diode each have a surface terminal, the surface terminals are coupled to the electrically conductive mounting surface of the second electrical base. The first semiconductor switch and first semiconductor diode are antiparallel, and the second semiconductor switch and second semiconductor diode are antiparallel.
Public/Granted literature
- US08054660B2 Inverter module with thermally separated semiconductor devices Public/Granted day:2011-11-08
Information query
IPC分类: