Invention Application
US20090286082A1 MONOMER FOR BINDING NANO-METAL, CONDUCTIVE POLYMER COMPOSITE AND METHOD OF PREPARING THE CONDUCTIVE POLYMER COMPOSITE
有权
用于结合纳米金属，导电聚合物复合材料的单体和制备导电聚合物复合材料的方法
- Patent Title: MONOMER FOR BINDING NANO-METAL, CONDUCTIVE POLYMER COMPOSITE AND METHOD OF PREPARING THE CONDUCTIVE POLYMER COMPOSITE
- Patent Title (中): 用于结合纳米金属，导电聚合物复合材料的单体和制备导电聚合物复合材料的方法
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Application No.: US12275745Application Date: 2008-11-21
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Publication No.: US20090286082A1Publication Date: 2009-11-19
- Inventor: Byung Hee SOHN , Young Kwan LEE , Yi Yoiung YUN , Won Jae JOO
- Applicant: Byung Hee SOHN , Young Kwan LEE , Yi Yoiung YUN , Won Jae JOO
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2008-0044482 20080514
- Main IPC: B32B15/08
- IPC: B32B15/08 ; C08G75/00 ; B05D3/00
Abstract:
Disclosed herein is a monomer for binding nano-metal, which is useful for the preparation of a conductor having increased conductivity with ensuring flexibility and transparency. Polymerization of the monomer for binding nano-metal provides a conductive polymer composite including a nano-metal rod. A method of preparing the conductive polymer composite is also provided.
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