发明申请
- 专利标题： LEAD-FREE SOLDER
- 专利标题（中）： 无铅焊枪
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申请号： US12497039申请日： 2009-07-02
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公开(公告)号： US20090286093A1公开(公告)日： 2009-11-19
- 发明人: Kazuyuki MAKITA , Masaki Ichinose , Taketo Watashima , Masayuki Soutome , Mitsuo Yamashita , Takeshi Asagi , Masatoshi Hirai , Toru Murata
- 申请人： Kazuyuki MAKITA , Masaki Ichinose , Taketo Watashima , Masayuki Soutome , Mitsuo Yamashita , Takeshi Asagi , Masatoshi Hirai , Toru Murata
- 申请人地址： JP Tokyo
- 专利权人： FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
- 当前专利权人： FUJI ELECTRIC DEVICE TECHNOLOGY CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2005-228841 20050805
- 主分类号： B23K35/14
- IPC分类号： B23K35/14 ; B32B15/04 ; C22C1/00
摘要：
According to one embodiment of the invention, there is provided a lead-free solder including an alloy rolled into a shape of sheet. The alloy includes: tin; from 10 wt % to less than 25 wt % of silver; and from 3 wt % to 5 wt % of copper. The alloy is free from lead.
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