发明申请
- 专利标题： PERFORATED SUPPORT PLATE
- 专利标题（中）： 执行支持板
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申请号： US12448499申请日： 2007-11-26
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公开(公告)号： US20090288780A1公开(公告)日： 2009-11-26
- 发明人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
- 申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
- 优先权： JP2006-355508 20061228
- 国际申请： PCT/JP2007/001295 WO 20071126
- 主分类号： B32B37/12
- IPC分类号： B32B37/12
摘要：
To provide a perforated support plate with high rigidity, the perforated support plate for supporting a surface of a wafer by interposing an adhesive layer comprises a reinforcing part for deflection prevention.