发明申请
US20090288803A1 Heat sink for chips 审中-公开
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Heat sink for chips
摘要:
A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.
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