发明申请
- 专利标题: Heat sink for chips
- 专利标题(中): 芯片散热片
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申请号: US12155853申请日: 2008-06-11
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公开(公告)号: US20090288803A1公开(公告)日: 2009-11-26
- 发明人: Wei-Hau Chen , Steven Yen
- 申请人: Wei-Hau Chen , Steven Yen
- 专利权人: CompTake Technology Inc.
- 当前专利权人: CompTake Technology Inc.
- 优先权: TW097208853 20080521
- 主分类号: F28F7/00
- IPC分类号: F28F7/00
摘要:
A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.
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