发明申请
- 专利标题: ELECTRONIC COMPONENTS MOUNTING ADHESIVE AND ELECTRONIC COMPONENTS MOUNTING STRUCTURE
- 专利标题(中): 电子元件安装粘合剂和电子元件安装结构
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申请号: US12096234申请日: 2007-09-13
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公开(公告)号: US20090291314A1公开(公告)日: 2009-11-26
- 发明人: Tadahiko Sakai , Hideki Eifuku , Kouji Motomura
- 申请人: Tadahiko Sakai , Hideki Eifuku , Kouji Motomura
- 申请人地址: JP Osaka
- 专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址: JP Osaka
- 优先权: JP2006-251070 20060915
- 国际申请: PCT/JP2007/068331 WO 20070913
- 主分类号: B32B15/00
- IPC分类号: B32B15/00 ; C08K3/08
摘要:
The invention intends to provide an electronic component mounting adhesive that can inhibit cracks and peelings in an electronic component mounting structure obtained by joining electronic components each other from occurring and an electronic component mounting structure obtained by joining electronic components with such an electronic component mounting adhesive. In an electronic component mounting structure, a first circuit board and a second circuit board are bonded with an electronic component mounting adhesive. Here, the electronic component mounting adhesive is obtained by dispersing metal particles having the melting temperature Mp lower than the glass transition temperature Tg of a cured material of a thermosetting resin in the thermosetting resin.