A solenoid coil/connector assembly includes a coil assembly having coil wires wound around a bobbin, an overmold encapsulating the coil assembly, and a plurality of seals formed between the bobbin and the overmold using laser light, the seals hermetically sealing the coil wires. By using a laser welding process for plastic materials directed at an internal interface between the bobbin and overmold the coil wires become hermetically sealed and moisture is thus prevented from gaining access to coil wires during use of the solenoid coil/connector assembly.