The invention concerns an anisotropic conductive film used for adhering IC, e.g., LCD displays, etc. The conductive film is characterized by comprising a thermosetting adhesive, super-paramagnetic metal oxide nano-particles, and conductive particles, the super-paramagnetic metal oxide nano-particles and the conductive particles being dispersed in a thermosetting composition. With such a configuration in the invention, it is advantageous that low temperature curing is implemented by means of high frequencies and positions of particles can be controlled by means of a magnetic field in adhering IC, e.g., LCD displays, so that high connection reliability is achieved for connection electrodes of fine pitches.