发明申请
- 专利标题: BALUN
- 专利标题(中): 巴伦
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申请号: US12196814申请日: 2008-08-22
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公开(公告)号: US20090295495A1公开(公告)日: 2009-12-03
- 发明人: Ching-Hung Liu , Chen-Chung Liu , Keng-Hong Wang
- 申请人: Ching-Hung Liu , Chen-Chung Liu , Keng-Hong Wang
- 申请人地址: TW Hsinchu
- 专利权人: CYNTEC CO., LTD.
- 当前专利权人: CYNTEC CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 优先权: TW97119950 20080529
- 主分类号: H01P5/10
- IPC分类号: H01P5/10
摘要:
A balun includes a first, second, and third metallic layers, a first dielectric layer disposed between the second and third metallic layers, and a dielectric substrate. The second metallic layer includes a first spiral line having sequentially connected first line segments and a second spiral line having sequentially connected second line segments. A first distance between each two opposite sides of a first region encircled by the innermost first line segments is greater than a second distance between each two adjacent parallel first line segments. A third distance between each two opposite sides of a second region encircled by the innermost second line segments is greater than a fourth distance between each two adjacent parallel second line segments. The third metallic layer includes a third and a fourth spiral lines. The first metallic layer and other elements as a whole are disposed on an opposite surface of the dielectric substrate.
公开/授权文献
- US07924112B2 Balun 公开/授权日:2011-04-12
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