A method for manufacturing a solid-state pickup device module of the present invention includes: a step of processing a transparent substrate so that each of transparent substrates for a chip is held opposite to each of solid-state image pickup devices when the transparent substrate and a substrate having a plurality of solid-state image pickup devices are opposed to each other (step of processing a transparent substrate; S1 to S17); and a modularizing step in which the transparent substrate thus processed and the substrate having a plurality of solid-state image pickup devices are opposed to each other so as to place each of the transparent substrates for a chip opposite to each of the solid-state image pickup devices (modularizing step; S21 to S28). Thus, the present invention can improve manufacturing efficiency by bonding the transparent substrate and the substrate having a plurality of solid-state image pickup devices at a time. In addition, the present invention provides a method for manufacturing a solid-state image pickup device module whereby a wafer can be easily cut.