发明申请
- 专利标题： Printed circuit board including electronic component embedded therein and method of manufacturing the same
- 专利标题（中）： 包含嵌入其中的电子部件的印刷电路板及其制造方法
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申请号： US12219441申请日： 2008-07-22
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公开(公告)号： US20090301766A1公开(公告)日： 2009-12-10
- 发明人: Hwa Sun Park , Yul Kyo Chung , Jin Won Lee , Jin Soo Jeong
- 申请人： Hwa Sun Park , Yul Kyo Chung , Jin Won Lee , Jin Soo Jeong
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2008-0052675 20080604
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H01R43/00
摘要：
Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.