发明申请
US20090302323A1 Method and apparatus for providing a low-level interconnect section in an imager device
审中-公开
在成像器装置中提供低级互连部分的方法和装置
- 专利标题： Method and apparatus for providing a low-level interconnect section in an imager device
- 专利标题（中）： 在成像器装置中提供低级互连部分的方法和装置
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申请号： US12155455申请日： 2008-06-04
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公开(公告)号： US20090302323A1公开(公告)日： 2009-12-10
- 发明人: Zhiping Yin , Xiangli Li
- 申请人： Zhiping Yin , Xiangli Li
- 专利权人： Micron Technology, Inc.
- 当前专利权人： Micron Technology, Inc.
- 主分类号： H01L31/112
- IPC分类号： H01L31/112 ; H01L31/18
摘要：
Imager pixels with low-level interconnect sections, methods of assembling imager pixels with low-level interconnect sections, and systems containing imager pixels with low-level interconnect sections. Imager pixels are formed such that specific interconnections between transistors and other components of an imager array are removed from one or more upper level metallization sections and placed on a low-level interconnect section closer to the photodetector, such that one upper metallization section is eliminated.
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