发明申请
- 专利标题： Heat Sink For Power Module
- 专利标题（中）： 功率模块散热片
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申请号： US11922945申请日： 2006-06-27
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公开(公告)号： US20090302458A1公开(公告)日： 2009-12-10
- 发明人: Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
- 申请人： Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
- 优先权： JP2005-186077 20050627
- 国际申请： PCT/JP2006/312787 WO 20060627
- 主分类号： H01L23/367
- IPC分类号： H01L23/367 ; H05K7/20
摘要：
A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.
公开/授权文献
- US08411438B2 Heat sink for power module 公开/授权日：2013-04-02
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