- 专利标题： ASSEMBLY INCLUDING PLURAL THROUGH WAFER VIAS, METHOD OF COOLING THE ASSEMBLY AND METHOD OF FABRICATING THE ASSEMBLY
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申请号： US12544344申请日： 2009-08-20
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公开(公告)号： US20090308578A1公开(公告)日： 2009-12-17
- 发明人: Kerry Bernstein , Thomas Brunschwiler , Bruno Michel
- 申请人： Kerry Bernstein , Thomas Brunschwiler , Bruno Michel
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： F28D15/00
- IPC分类号： F28D15/00
摘要：
An assembly includes a chip including an integrated circuit, a casing including an integrated circuit and having an upper portion formed on a side of the chip and lower portion formed on another side of the chip, plural through-wafer vias (TWVs) for electrically connecting the integrated circuit of the chip and the integrated circuit of the casing, and a card connected to the casing for electrically connecting the casing to a system board.