发明申请
- 专利标题： HEAT SINK
- 专利标题（中）： 散热器
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申请号： US12547161申请日： 2009-08-25
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公开(公告)号： US20090308581A1公开(公告)日： 2009-12-17
- 发明人: Yoshiro Tanaka , Hisashi Yoshinaga
- 申请人： Yoshiro Tanaka , Hisashi Yoshinaga
- 申请人地址： JP Kawasaki-shi
- 专利权人： FUJITSU LIMITED
- 当前专利权人： FUJITSU LIMITED
- 当前专利权人地址： JP Kawasaki-shi
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F28F7/00
摘要：
The heat sink include a conductive heat dissipation portion for dissipating heat of an electronic component into the air, and a current limitation portion arranged on the heat dissipation surface of the heat dissipation portion and limiting a discharge current flowing between a material object located in proximity to the heat dissipation surface and the heat dissipation portion when discharge phenomenon takes place between the material object and the heat dissipation portion.